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Journal of Applied Sciences and Environmental Management
World Bank assisted National Agricultural Research Project (NARP) - University of Port Harcourt
ISSN: 1119-8362
Vol. 22, No. 11, 2018, pp. 1797-1800
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Bioline Code: ja18301
Full paper language: English
Document type: Research Article
Document available free of charge
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Journal of Applied Sciences and Environmental Management, Vol. 22, No. 11, 2018, pp. 1797-1800
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Effect of Fins Arrangement on Thermal Performance in Microelectronics Devices
EKPU, M
Abstract
Heat sink fins arrangement are important in heat management in microelectronics devices because
it helps in the dissipation of heat from the chip level device to the environment and provide an efficiently working
device. In this light, investigation was conducted on the effect of fins arrangement on thermal performance in
microelectronics devices using the ANSYS finite element design software. The results obtained showed a maximum
temperature range of between 95.27 – 126.79 oC, thermal resistance of 1.2 – 1.8 K/W, and thermal efficiency of 15 –
37%. The results demonstrated that, the arrangement of heat sink fins largely affects the thermal resistances and
efficiencies of the microelectronic device. In addition, the A1 rectangular fins arrangement exhibited better thermal
capabilities over the other fins arrangements investigated. This research can aid the development of future heat sinks
to accommodate customer demands.
Keywords
heat transfer; fin arrangement; microelectronics
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© Copyright 2018 - Ekpu
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